Ryan 10W Portable Fiber Laser Marking Machine (Bong manager 187-58-72-23-00) laser machining principle: Laser Marking the use of high energy density laser beam, local irradiation on the surface, so that the surface material or the occurrence of rapid vaporization color change, thereby exposing the underlying substance, or cause physical changes in the surface chemical substances and carve traces, or by light burned portion of the material, showing the required etched graphics, text. Model Features: 1. The use of third-generation solid fiber laser, electro-optical conversion efficiency, high beam quality 2. Excellent beam quality, creating the effect of ultra-fine marking 3. The original German scan head. Mark fast, ordinary YAG and DP semiconductor marking machine more than 4 times, saving you costly labor wages 4. The air-cooled, no supplies, maintenance-free, low cost. Energy saving, the whole power is only 300W. Compared to lamp-pumped semiconductor laser marking machine annual electricity savings of 2-3 million. 5. The integrated modular design, easy maintenance, small size. Saving you valuable plant space. 6. Mark the environmental protection, RoHS compliant. Scope can engrave and mark the metal and nonmetal materials. More suitable for some requirements for more sophisticated, higher accuracy of the occasion. Applied to depth, smoothness, finesse demanding areas, such as integrated circuit chip IC, mobile phone keys, computer accessories, auto parts, plastic, paper materials, hardware tools, watches and clocks, electronic hardware, sanitary ware, electronics and communications products, aerospace components, gift accessories, medical equipment, mold, bitmap marking and so on. Application materials ordinary metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver, titanium), metal oxides (metal oxide may be), special surface treatment ( phosphide, aluminum anodizing, plating surface), ABS material (shell appliances, daily necessities), ink (translucent keys, printing products), epoxy resin (packaging, insulation layer electronic components).